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This machine is used
to control the cristal orientation of semiconductor ingots before cutting.
The very precise measurement of diffracted angles in 4 orientations (every 90°) is transmitted to a special program which calculates the two correction angles for fixation of the ingot on the slicing support. These two angles correspond to a rotation of the ingot on its axis and a small deviation from the slicing support to get the desired cutting angle. The signal wavelength of 1.5405 A allows to measure the most used semiconductors like Si, Ge, GaAs, ... The machine can measure ingots from 4 to 10 " diameter and 400 mm max. length. The goniometer measures angles between 10 to 90 ° with 0.01° resolution. |
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Diffracted signal given |
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